top of page

Siemens I/O Link Overview

  • rebeccavanessendel
  • 6 days ago
  • 2 min read

Integrate Sensors and Actuators Seamlessly


A continuous communication down to the lowest field level ensures enhanced use of the functions and performance capability of sensors and actuators. Enhanced use of sensors and actuators allows the user to operate the machines and plants more productively.


No data other than the actual process value can be exchanged via the standard interfaces (digital, analog) used at the sensor/actuator level. Sensors and actuators with integrated intelligence are now used for increasingly complex functions and require a communication interface tailored to these requirements.


Advantages of IO-Link

  • Open standard in accordance with IEC 61131-9

    • Devices can be integrated in the same way in all conventional fieldbus systems and automation systems

  • Tool supported parameter setting and central data management

    • Fast configuration and commissioning 

    • Simple creation of current plant documentation even for sensors/actuators 

  • Single, uniform wiring and far fewer different interfaces at the sensors/actors

    • Standardized, uniform interface for sensors and actuators independent of their complexity (switching, measuring, multi-channel, binary, mixed signals, etc.)

    • Reduction in the variety of types of inventory 

    • Fast commissioning 

    • Any combination of IO-Link devices and sensors/actuators without IO-Link at IO-Link master

  • Continuous communication between sensors/actuators and the CPU

    • Access to all process data, diagnostic data and device information 

    • Access to device-specific data, such as energy data

    • Remote diagnostics can be performed

  • Continuous diagnostic information down to sensor/actuator level

    • Reduction in troubleshooting effort

    • Minimizing risk of failure

    • Preventative maintenance and optimization of service and maintenance planning 

  • Dynamic change of sensors/actuators parameters by the controller or the operator at the HMI

    • Reduction in downtimes during product change

    • Increased variability of the machine 

  • Automatic reassignment of parameters when devices are replaced during operation

    • Minimization of downtimes

    • Device replacement by untrained personnel without additional aids

    • Avoidance of incorrect settings

  • Integrated device identification 

    • Identification of the installed devices

    • Ensure quality of result in production and manufacturing when replacing the device


Example Plant with IO-Link

(1) SIRIUS relay 3UG48

(2) Actuators

(3) SIRUIS compact starters 3RA6

(4) SIRIUS load feeders 3RA2 with function modules 3RA27

(5) ET 200SP with IO-Link master

(6) SIRIUS contactor 3RT2 with SIRIUS relay 3RR24

(7) S7-1200/S7-1500 automation system

(8) SIRIUS overload relay 3RB24

(9) SIRIUS relay 3RS14/3RS15

(10) SIMATIC ET 200eco PN M12-L with IO-Link master

(11) RFID system RF200

(12) RFID system RF200

(13) Standard sensors

(14) ET 200AL IO-Link IO module

Components

An IO-Link system consists of the following components:

  • IO-Link master

  • IO-Link device, for example: 

    • Sensors/actuators

    • RFID readers

    • I/O modules

    • Valves 

  • Unshielded 3-wire or 5-wire standard cables

  • Engineering tool for configuring and assigning parameters of IO-Link


Power-Flo Technologies is proud to partner with Siemens and their IO-Link technology that represent a significant leap forward in industrial automation by enabling seamless, intelligent communication from the control level all the way down to individual sensors and actuators. With its standardized interface, flexible integration, and rich diagnostic capabilities, IO-Link empowers operators to maximize productivity, minimize downtime, and simplify device management across a wide range of applications. Whether it's enabling remote diagnostics, facilitating quick device replacement, or supporting advanced data access, IO-Link lays the foundation for smarter, more efficient, and future-ready manufacturing environments.



 
 
bottom of page